What is the temperature of the plasma enhanced PECVD coating electric furnace?

The temperature range of plasma enhanced PECVD coating electric furnace varies depending on the equipment model and application requirements. The common temperature ranges are as follows:

Low temperature range: usually between 200 ℃ and 400 ℃, suitable for materials or processes that are sensitive to heat, such as flexible electronic devices, organic materials, etc. This low-temperature process can avoid thermal damage to the substrate material caused by high temperatures, while maintaining a high deposition rate and film quality.

Medium temperature range: Some equipment can operate at temperatures ranging from 450 ℃ to 800 ℃, suitable for deposition processes that require higher reactivity, such as the growth of certain semiconductor materials or the deposition of thin films with specific chemical compositions.

High temperature range: The working temperature of a few high-end devices can reach up to 1200 ℃, suitable for special processes that require high temperatures, such as the deposition of certain high melting point materials or the growth of specific crystal structures. However, high-temperature PECVD processes are relatively rare, as most PECVD applications aim to utilize plasma assisted low-temperature deposition.