Common faults and troubleshooting methods of plasma enhanced PECVD coating electric furnace

During the use of plasma enhanced PECVD coating electric furnace, various faults may occur. The following are some common faults and their troubleshooting methods:

1. Unable to light up
Possible reasons:
RF power supply failure, abnormal power output of RF power supply.
The gas intake is small and the gas flow meter is abnormal.
The cleanliness of the cavity plates is insufficient, and the resistance of the upper and lower plates to ground is abnormal.
RF matching circuit fault, RF source reflection power is not within the normal range.
The vacuum degree is too poor, and the chamber vacuum degree is abnormal.

Exclusion method:
Check if the power output of the RF source power supply is normal.
Check the gas flow meter, and if it is normal, increase the intake volume for testing.
Measure the ground resistance of the upper and lower plates of the cavity with a multimeter. The normal value should be above tens of megaohms. If there is an abnormality, clean the cavity plates.
Check if the capacitors and inductors in the RF matching circuit are damaged.
Check if the vacuum degree in the chamber is normal.

2. Radiant instability
Possible reasons:
The power supply current is unstable.
Unstable pressure inside the vacuum chamber, abnormal leakage rate of the vacuum system, or abnormal intake volume of the chamber.
Cable malfunction, poor cable contact.

Exclusion method:
Measure whether the power supply is stable.
Check the leakage rate of the vacuum system in the chamber and the intake volume of the chamber.
Check if the cable contact is good.

3. Insufficient film-forming quality
Possible reasons:
The cleanliness of the outer surface of the sample is poor.
The cleanliness of the process chamber is poor.
The sample temperature is abnormal, the temperature control system is malfunctioning, or the temperature measuring thermocouple is inaccurate.
Abnormal pressure during film deposition and abnormal leakage rate in the vacuum system of the chamber.
The RF power setting is unreasonable.

Exclusion method:
Check if the surface of the sample is clean.
Clean the process chamber.
Check if the temperature control system is functioning properly and calibrate the temperature measuring thermocouple.
Check the leakage rate of the chamber vacuum system.
Check the RF power supply and adjust the set power.

4. Low sedimentation rate
Possible reasons:
The RF input power is not appropriate.
Abnormal sample temperature, abnormal cooling water flow rate and temperature.
The pressure in the vacuum chamber is low.

Exclusion method:
Adjust the RF power.
Check if the cooling water flow and temperature are normal.
Adjust the process gas flow rate.

5. Abnormal pressure in the reaction chamber
Possible reasons:
The corrugated pipe of the equipment vacuum system has cracks.
The gas flow meter is abnormal.
The butterfly valve switch is abnormal.
The vacuum pump is abnormal.

Exclusion method:
Check if there are cracks in the bellows of the vacuum system of the equipment.
Check if the gas flow meter is functioning properly.
Manually check if the butterfly valve switch is functioning properly.
Measure the pumping speed of the vacuum pump with a vacuum gauge to see if it is normal.