The bell shaped lifting high-temperature muffle furnace exhibits significant advantages in material processing, process control, and operational safety through its unique lifting structure design, precise temperature control system, and multifunctional adaptability. It is particularly suitable for scenarios with strict requirements for temperature uniformity, operational convenience, and environmental control. The following is a detailed analysis of its core advantages:
1. Convenient operation: Improve efficiency and reduce human error
Vertical lifting for material retrieval, maximizing space utilization
Traditional side opening furnace doors require reserved horizontal operating space, while bell shaped furnace doors achieve material retrieval and placement through vertical lifting at the bottom, which takes up more space and is particularly suitable for scenarios where laboratory or production line space is limited.
The lifting material platform can be designed as a platform type structure, supporting manual or robotic arm automatic loading and unloading. When handling large workpieces (such as ceramic discs with a diameter greater than 500mm), the operation time is shortened and direct exposure to personnel in high-temperature environments is avoided.
Contactless opening and closing, reducing heat loss
During the lifting process of the furnace door, there is no friction with the furnace, and the temperature wave caused by thermal convection can be controlled within ± 1 ℃ (traditional side opening furnace door temperature wave can reach ± 5 ℃ or above), ensuring the stability of the heat treatment process, especially suitable for temperature sensitive materials (such as lithium battery cathode materials).
2. Temperature control accuracy: meets the needs of scientific research and industrial grade
PID intelligent temperature control system, accuracy ± 1 ℃
Dynamically adjust the heating power through the proportional integral derivative (PID) algorithm to eliminate temperature fluctuations during the heating plateau period. For example, when sintering alumina ceramics at 1600 ℃, the temperature uniformity inside the furnace can reach ± 5 ℃, and the data repeatability meets scientific research standards (such as material synthesis experiments).
Support multiple programmable heating curves (such as 30 stage programmed temperature control), simulate complex heat treatment processes (such as step annealing, rapid quenching), and improve material performance consistency.
High performance heating element, balancing lifespan and efficiency
Silicon molybdenum rod heating elements (working temperature 1500-1800 ℃) have strong creep resistance and a lifespan of over 5000 hours, which is 150% higher than silicon carbon rods (2000 hours) and reduces long-term usage costs.
The heating element layout adopts a three-dimensional radiation design, combined with the alumina fiber board lining the furnace, to improve thermal efficiency.
3. Sealing and Atmosphere Control: Expanding Material Processing Boundaries
Double layer sealing structure for vacuum/inert gas protection
The furnace door adopts a double-layer design of ceramic fiber pressure strip and metal sealing ring, which can be evacuated to 10 ⁻ Pa with a vacuum pump, effectively preventing metal oxidation (such as titanium alloy heat treatment) or material contamination.
Support the introduction of inert gases such as nitrogen and argon, with adjustable pressure range, to meet the requirements of high-pressure sintering (such as transparent ceramics) or vapor deposition processes.
Observation window and reflector design for real-time monitoring of the manufacturing process
The side of the furnace is equipped with a high-temperature resistant quartz observation window (with a temperature resistance of 1200 ℃), and some models integrate a back reflector, supporting 360 ° observation of material melting and shrinkage processes without blind spots, and timely adjustment of process parameters (such as heating rate).
4. Security protection: comprehensive guarantee of personnel and equipment safety
Multiple security mechanisms to reduce operational risks
Overtemperature alarm: When the furnace temperature exceeds the set value, the heating power is automatically cut off and an audible and visual alarm is triggered to prevent material overheating.
Leakage protection: to avoid electric shock accidents.
Power off when opening the door: The power supply to the heating element is immediately cut off when the furnace door is opened, preventing heat waves from spraying out and injuring people, while protecting the heating element from cold shock damage.
Low surface temperature design reduces the risk of burns
The furnace body adopts a double-layer shell structure, filled with insulation cotton in the middle, with a low surface temperature, which can be safely touched even after long-term operation.
5. Application scenario adaptability: covering the needs of the entire industry
Materials Science Field
Ceramic sintering: Sintering zirconia ceramics at 1600 ℃ results in higher density and greater bending strength, meeting high-end application requirements.
Metal heat treatment: Annealing at 450 ℃ is performed on aviation aluminum alloys to eliminate internal stress, increase elongation, reduce hardness, and significantly improve processing performance.
new energy industry
Synthesis of lithium battery materials: By optimizing the temperature rise curve of ternary materials (NCM/NCA) through precise temperature control, the energy density of the battery is improved and the cycle life is extended.
Preparation of Solid Electrolyte: Under inert gas protection, the 1200 ℃ sintering of sulfide solid electrolyte is completed, and the ion conductivity is close to that of liquid electrolyte.
Semiconductors and Electronic Components
Wafer oxidation/diffusion: Achieve 1200 ℃ oxidation of silicon chips in a vacuum environment, with better uniformity of oxide layer thickness, meeting the requirements of chip manufacturing.
Ceramic substrate sintering: Combined with high-pressure atmosphere, achieve bubble free sintering of aluminum nitride ceramic substrates, suitable for high-power electronic devices.