The ceramic hot press sintering furnace can efficiently sinter a variety of high-performance ceramic materials through the synergistic effect of high temperature and pressure, especially suitable for material systems that are difficult to densify using conventional sintering processes. Its core advantage lies in promoting material densification and suppressing abnormal grain growth, thereby enhancing the mechanical and thermal properties of the material. The following are its main sintering objects and typical applications:
1. Covalent bonding compound ceramics
Silicon nitride (Si ∝ N ₄):
Hot pressing sintering is a key technology for preparing high thermal conductivity and high strength silicon nitride ceramics. By optimizing process parameters (such as temperature 1700-1800 ℃, pressure 20-30MPa), fine-grained structural materials with high thermal conductivity and bending strength can be obtained, which are widely used in semiconductor equipment heat dissipation components, bearing balls, etc.
Silicon carbide (SiC):
Hot pressing sintering can reduce the sintering temperature to 1600-1700 ℃, shorten the cycle to 2-3 hours, and prepare fine-grained silicon carbide ceramics with higher hardness, suitable for high wear resistance scenarios such as cutting tools and bulletproof armor.
Boron carbide (B ₄ C):
In response to its strong covalent bonds and slow diffusion rate, hot pressing sintering achieves densification through segmented pressure (1800-2200 ℃) to prepare neutron absorbing materials with high bending strength and strong fracture toughness, which are used for nuclear reactor control rods.
2. Oxide ceramics
Aluminum oxide (Al ₂ O3):
Hot pressing sintering can suppress grain growth, obtain fine-grained alumina ceramics, improve bending strength, and have strong fracture toughness. It is suitable for electronic packaging substrates, biomedical implants, etc.
Zirconia (ZrO ₂):
Partially stable zirconia (PSZ) was prepared by hot pressing sintering, and the fracture toughness was improved by utilizing the phase transformation toughening mechanism. It is used in high toughness demand scenarios such as tool coatings and dentures.
3. Composite ceramic materials
Particle reinforced ceramics:
Hot pressing sintering can achieve uniform dispersion of nanoparticles (such as TiC, SiC) in the matrix, and prepare TiC/Al ₂ O3 composite materials with improved hardness and high bending strength, suitable for molds, wear-resistant parts, etc.
Fiber reinforced ceramics:
Carbon fiber reinforced silicon carbide (C/SiC) composite materials are prepared by hot pressing sintering, which have high bending strength and strong fracture toughness, and are used for aerospace hot end components such as turbine rotor blades.
4. Special functional ceramics
Transparent ceramics:
Aluminum nitride (AlN) transparent ceramics with a transmittance of over 80% can be prepared by hot pressing sintering. They have high thermal conductivity and are used for high-power laser windows, infrared detector substrates, etc.
Piezoelectric ceramics:
Optimizing the grain orientation of lead zirconate titanate (PZT) ceramics through hot pressing sintering to increase the piezoelectric constant, suitable for ultrasonic transducers, sensors, etc.
Bioceramics:
Hydroxyapatite (HA) bioceramics prepared by hot pressing sintering have low porosity, high bending strength, and excellent compatibility with human bone tissue. They are used for bone repair, dental implants, and other applications.
5. Refractory metal ceramics
Tungsten copper (W-Cu) alloy:
Hot pressing sintering can achieve dense bonding between tungsten particles and copper matrix, and prepare electronic packaging materials with high thermal conductivity and strong bending strength, which are used for high-power integrated circuit heat dissipation substrates.
Molybdenum silicide (MoSi ₂):
Preparation of high melting point (2030 ℃) molybdenum silicide ceramics by hot pressing sintering, used for high-temperature heating elements, aviation engine blade coatings, etc.