Ceramic hot press sintering furnaces usually have vacuum pumping function, which is one of their core designs aimed at meeting the special process requirements for sintering high-performance ceramic materials. The following provides a detailed explanation from the aspects of technical principles, equipment types, process advantages, and typical application scenarios:
1. The technical principle and necessity of vacuum pumping
Inhibition of oxidation reaction:
Ceramic materials such as silicon carbide and silicon nitride are prone to react with oxygen at high temperatures, leading to the formation of surface oxide layers, hindering densification and reducing performance. Vacuuming can lower the oxygen content inside the furnace and effectively suppress oxidation reactions.
Promote the elimination of volatile compounds:
Some ceramic systems, such as zirconia doped ceramics, will release low melting point impurities (such as PbO, B ₂ O3) during the sintering process. A vacuum environment can reduce the vapor pressure of impurities, accelerate their volatilization, and purify the microstructure of materials.
Optimize mass transfer mechanism:
Under vacuum conditions, the adsorption of gas on the surface of particles decreases, and the surface diffusion coefficient increases by 1-2 orders of magnitude, significantly promoting particle rearrangement and neck growth, reducing sintering temperature, and shortening the cycle.
2. Vacuum system configuration of ceramic hot pressing sintering furnace
Vacuum pump assembly:
Mechanical pump: As a front-end pump, it pumps the pressure inside the furnace from atmospheric pressure to the level of 10 ⁻¹ Pa.
Molecular pump/diffusion pump: As a high vacuum pump, it further reduces the pressure to below 10 ⁻ Pa to meet the requirements of ultra-high temperature sintering.
Roots pump (optional): used in the medium vacuum stage to increase the pumping rate.
Vacuum chamber design:
Double layer water-cooled structure: using 304/316L stainless steel or high-purity graphite inner liner, with outer circulating water cooling to prevent high-temperature deformation and maintain vacuum sealing.
Dynamic sealing technology: Metal bellows are used to seal between the hot pressing rod and the furnace body, allowing axial pressure transmission while maintaining vacuum degree.
Observation window design: equipped with quartz or sapphire windows, supporting in-situ observation of material deformation in high-temperature vacuum environments.
Vacuum degree control:
Composite vacuum gauge: equipped with both thermocouple vacuum gauge (coarse measurement) and ionization vacuum gauge (fine measurement).
Automatic inflation system: After sintering is completed, high-purity argon or nitrogen gas can be injected to achieve rapid cooling and prevent material oxidation.
3. Typical application scenarios of vacuum hot pressing sintering
Preparation of Transparent Ceramics:
Materials: Aluminum Nitride (AlN), Magnesium Aluminum Spinel (MgAl ₂ O ₄).
Process: Hot press sintering at 2000 ℃ and 10 ⁻ Pa vacuum, with a transmittance of over 85%, used for laser windows and infrared detector substrates.
High thermal conductivity ceramic substrate:
Materials: silicon nitride (Si ∝ N ₄), silicon carbide (SiC).
Process: Hot pressing under vacuum at 1750 ℃ and 10 ⁻⁴ Pa, with high thermal conductivity and bending strength, used for power electronics packaging.
Bioceramic implants:
Materials: Hydroxyapatite (HA), Zirconia (ZrO ₂).
Process: Hot pressing under vacuum at 1400 ℃ and 10 ⁻ Pa, with low porosity, strong bending strength, and excellent compatibility with human bone tissue.