The customized 1700 ℃ box type muffle furnace can be fully used for annealing processes. Its ultra-high temperature performance, precise temperature control, and flexible customization ability enable it to meet the annealing needs of various materials, especially high-temperature alloys, ceramic materials, and other scenarios that require annealing treatment at high temperatures. The following is a specific analysis:
1. Adaptability of 1700 ℃ high temperature to annealing
Covering the high-temperature annealing temperature range
Annealing of high-temperature alloys: The annealing temperature of nickel based and cobalt based high-temperature alloys is usually between 1000-1250 ℃, but some special treatments (such as intermediate annealing after solution treatment) may require higher temperatures (such as 1600-1700 ℃) to eliminate work hardening or residual stress.
Ceramic material annealing: Zirconia (ZrO ₂), silicon nitride (Si ∝ N ₄) and other ceramics need to undergo high-temperature annealing (1600-1700 ℃) after sintering to eliminate intragranular stress and improve material toughness.
Metal ceramic composite materials, such as TiC Ni based composite materials, may be annealed at temperatures up to 1700 ℃ to optimize the interface bonding between metal and ceramic.
Replace multiple medium and low temperature equipment
A single device can cover annealing needs from low temperatures (such as 600 ℃) to ultra-high temperatures (1700 ℃), avoiding the need to purchase multiple devices (such as 600 ℃, 1000 ℃, 1500 ℃ furnaces) due to temperature segmentation, and reducing equipment costs and space occupation.
2. Key requirements and customized solutions for annealing process
a. Temperature control accuracy
PID intelligent regulation: The temperature control accuracy reaches ± 1 ℃, supporting multiple programmable curves (such as step heating, constant temperature holding, gradient cooling), ensuring that temperature fluctuations during annealing do not affect material properties.
Example: High temperature alloy annealing requires a constant temperature of 1150 ℃ for 4 hours. By customizing the temperature control curve, the heating rate (such as 5 ℃/min) and constant temperature time can be accurately controlled to avoid grain coarsening or insufficient stress release.
Three dimensional temperature field monitoring: Real time monitoring of furnace temperature through embedded thermocouple array, with temperature field uniformity improved to ± 5 ℃ (at 1200 ℃), ensuring material performance consistency during batch annealing.
b. Furnace structure and materials
Special shaped furnace design: For long axis and thin-walled workpieces (such as aviation blades and ceramic pipes), customize “deep narrow” or “gradient temperature field” furnaces to reduce annealing deformation.
Example: The annealing of aircraft engine blades requires customized furnace dimensions (such as 800 × 300 × 300mm) to match the blade shape and avoid bending caused by uneven local heating.
Gradient composite structure: using multiple layers of zirconia mullite insulation layer, the thermal shock resistance is improved, it can withstand more thermal cycles, and extend the furnace life.
c. Atmosphere and pressure control
Multi channel gas system: supports the introduction of inert gases (such as argon and nitrogen) or reducing gases (such as hydrogen) to prevent material oxidation during high-temperature annealing.
Example: Annealing of titanium alloy needs to be carried out in an argon atmosphere, and the oxygen content in the furnace is ensured to be ≤ 10ppm through customized gas flow control (such as 5L/min).
Vacuum environment: Optional vacuum pump can be equipped to achieve a vacuum degree of ≤ 10 ⁻ ³ Pa, meeting the requirements of non oxidizing annealing (such as vacuum annealing of certain ceramic materials).
Pressure regulation: Integrated mechanical load superposition function (such as 0-50kN top rod loading device), suitable for hot isostatic pressing annealing (HIP), to improve material density.
d. Cooling rate control
Graded cooling function: Control the cooling rate through the program (such as 10 ℃/min → 5 ℃/min → 2 ℃/min) to avoid rapid cooling causing material cracking or performance degradation.
Example: After annealing, ceramic materials need to be slowly cooled to room temperature. By customizing the cooling curve, the cooling rate can be precisely controlled to reduce residual stress.
3. Typical annealing process case
a. Annealing of high-temperature alloys
Solid solution annealing: Introduce argon gas atmosphere at 1700 ℃, and use customized temperature control curve (heating to 1700 ℃ for 2 hours, constant temperature for 2 hours, cooling in the furnace to 600 ℃ and then air cooling) to eliminate work hardening and improve material plasticity (increase elongation).
Intermediate annealing: Intermediate annealing is carried out at 1650 ℃, using gradient temperature field design (furnace center temperature of 1650 ℃, edge temperature of 1600 ℃) to avoid deformation of thin-walled parts due to excessive temperature differences.
b. Annealing of ceramic materials
Stress relief of zirconia ceramics: Vacuum annealing at 1700 ℃, customized mechanical load superposition function (loading pressure of 10MPa) is used to prepare ceramic materials with higher bending strength and improved toughness.
Annealing of silicon nitride ceramic tube: A deep narrow furnace (Φ 50mm × 800mm) is used, and a nitrogen atmosphere is introduced at 1700 ℃ to prevent cracking of the tube through graded cooling function (10 ℃/min → 5 ℃/min).
c. Annealing of metal ceramic composite materials
Interface optimization of TiC Ni based composite materials: Hydrogen atmosphere is introduced at 1700 ℃, and a customized temperature control curve (heating to 1700 ℃ for 3 hours, constant temperature for 6 hours, and cooling with the furnace) is used to achieve dense bonding between metal and ceramic, and improve the interface bonding strength.